Tape & Reel In Real Production
Taipex supports automated handling of semiconductor and electronic components with molded reels, carrier tape, and cover tape engineered for static control, sealing stability, and dependable feeder performance.
Design, Prototyping & Production Support
Semiconductor & IC Handling
Taipex tape and reel solutions are used for surface mount integrated circuits and board level metal shields, with a focus on stable transport, automated placement, and consistent sealing quality across carrier tape, cover tape, and reel assemblies.
- AutoCAD chip fit analysis
- Fast-response prototype support
- In-line vision system control
Source documents describe proprietary high-speed pocket embossing, hole punching, and dimensional control to support automated handling and placement.
Discrete & Power Packages
Taipex 7" reel series support applications such as diodes, miniature capacitors, LEDs, SOT23, SOD123, SC70, SC59, and larger power or memory packages depending on reel construction and flange strength.
4.4A is presented as super lightweight, 1.6D as light to medium duty, and 1.6A as medium to heavy duty for broader component protection needs.
Automated SMT Lines
Tape and reel packaging supports automatic handling by combining static control, physical stability, and sealing consistency so components feed reliably through pick-and-place operations.
- EIA-481 packing reference
- Static dissipative packaging options
- Reels from 7" to 13" formats
Passive, LED & General Electronic Components
Source materials repeatedly reference compact and high-volume components, including passive parts and LED-related applications, where reel weight, flange stiffness, ESD behavior, and stable storage matter as much as dimensional fit.
LISTED IN COMPANY PROFILE
Application Matrix
A practical overview of where Taipex packaging solutions fit and which product attributes support each use case.
Ready to Match a Reel or Tape Format?
Share your component outline, tape width, or operating constraints and Taipex can support selection, chip fit review, and packaging feasibility based on documented product families.